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Review on the Development of Cross-Strait Semiconductor Industries Attractiveness News in 2013: Global Industry Analysis, Size, Share, Growth, Trends and Forecast Research Report

MarketResearchReports.Biz announces addition of new report “Review On The Development Of Cross-Strait Semiconductor Industries In 2013” to its database

 
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Albany, NY -- (SBWIRE) -- 04/03/2014 -- Market Survey On Review On The Development Of Cross-Strait Semiconductor Industries In 2013: Research Background & Research Ideas

Driven by the Chinese government's preferential policies and enormous domestic market needs, international semiconductor vendors have constantly set up plants in China to strengthen their deployment.

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The movement has also contributed to the development of Chinese IC design houses, manufacturers, and packaging and testing vendors. As a result, the Chinese semiconductor industry has seen stunning growth since 2010, posing serious threats to the development of the Taiwanese semiconductor industry.

This report will analyze the current status of Taiwanese and Chinese semiconductor industries as well as the existing and future development of the sub-industries in Taiwan and China.

Table of Contents

1.Comparison of Cross-Strait Semiconductor Industry\'s Production Value and Structure

2.Comparison of Cross-Strait IC Design Industries
2.1 Comparison of Industry Value
2.2 Development of Top Ten IC Design Houses in China and Taiwan
2.2.1 Smart Handheld Device Core IC Vendors
2.2.2 Panel Driver IC Vendors
2.2.3 Vendors in Other Industries

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3.Comparison of Cross-Strait IC Manufacturing Industries
3.1 Comparison of Industry Value
3.2 Chinese IC Manufacturing Industry Clusters
3.3 Development of Top Ten IC Manufacturers in China and Taiwan
3.4 Comparison of Process Technologies and Production Capacity

4.Comparison of Cross-Strait IC Packaging and Testing Industries
4.1 Comparison of Industry Value
4.2 Chinese IC Packaging and Testing Industry Clusters
4.3 Development of Top Ten IC Packaging and Testing Vendors in China and Taiwan
4.3.1 Development of Taiwanese IC Packaging and Testing Vendors
4.3.2 Development of Chinese IC Packaging and Testing Vendors
MIC Perspectives
Competition of IC Design for Smart Handheld Devices Intensifies
Increased Competition in 28nm Process Technology with Steady 8-inch Wafer Demand

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Appendix
Glossary of Terms

Table 1 Top Ten Chinese and Taiwanese IC Design Houses, 2012
Table 2 Top Ten Chinese and Taiwanese IC Manufacturers, 2012
Table 3 Top Ten Taiwanese IC Packaging and Testing Vendors, 2012 - 2013
Table 4 Top Ten Chinese IC Packaging and Testing Vendors, 2011 - 2012

Figure 1 Chinese and Taiwanese Semiconductor Industry Value, 2009 - 2015
Figure 2 Revenue Share of Chinese and Taiwanese Semiconductor Industries by Sector, 2008 - 2013
Figure 3 Chinese and Taiwanese IC Design Industry Value, 2004 - 2013
Figure 4 Chinese and Taiwanese IC Manufacturing Industry Value, 2006 - 2013
Figure 5 Chinese IC Manufacturing Industry Clusters
Figure 6 Process Technologies Adopted by Taiwanese, Chinese, and Foreign IC Manufacturers, 1Q 2012 – 4Q 2013
Figure 7 Production Capacity of Chinese and Taiwanese IC Manufacturing Industries, 2012 - 2016
Figure 8 Chinese and Taiwanese IC Packaging and Testing Industry Value, 2006 - 2013
Figure 9 Chinese IC Packaging and Testing Industry Clusters

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