Pune, India -- (SBWIRE) -- 03/30/2019 -- Asia-pacific was the leading geographic market and is projected to be the highest revenue contributor throughout the forecast period. Developed markets including China, Taiwan, and Japan has higher penetration however, there is still a lot of opportunities available for the semiconductor manufacturing equipment market to grow further even in the developed markets. The governments of these countries are making developments to improve investment scenario.

The governments are providing tax-rebates, funds, subsidies and other such support to attract the manufacturing companies to set-up plants in their respective countries. Further, several governments have taken initiatives such as Made in China 2025, and Make in India, among others to flourish the growth of manufacturing and other high-tech industries. The high growth in semiconductor manufacturing equipment is driven by high demand for more semiconductor applications in automotive, industrial, consumer goods, and other electronic products including wireless, storage products. Major portion of revenue contribution in the fabrication of semiconductor products is played by memory chips and sensors used in several application for different purposes. It is expected that the low penetration will propel considerable growth during the forecast period, as long as there is considerable support from the government to the manufacturers.

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The global semiconductor manufacturing equipment market accounted to US$ 62.10 Bn in 2018 and is expected to grow at a CAGR of 5.2% during the forecast period 2019 - 2027, to account to US$ 101.58 Bn by 2027.

Advanced packaging integrations in the manufacturing equipment

Semiconductor packaging forms an integral and important part of the semiconductor manufacturing process. IC packaging is important as the semiconductor industry faces constant trade-offs between the performance of the devices and reducing the IC footprints. Advanced packaging techniques ensure longer battery life, higher performance, and integration of multi-functionalities while reducing the IC footprint integrated into any electronics device. The emerging packaging techniques being employed in the semiconductor manufacturing process today include 2.5D & 3D packaging through the technology Through Silicon Vias (TSV), Wafer Level packaging Technologies, and Fan-in as well as Fan-out technologies at the panel level. Furthermore, redistribution layer material (RDL) is used in these advanced semiconductor packaging technologies to maintain proper conductivity in the circuit and enhance the functioning between the I/O pads and IC. These advanced packaging technologies are anticipated to have a significant impact in the manufacturing process for semiconductors and therefore directly impact the semiconductor manufacturing equipment market.

Equipment Type Insights

The global semiconductor manufacturing equipment market by equipment type is segmented in to Wafer Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment, and Others. Semiconductor fabrication needs a manufacturing equipment in a clean room for the fabrication of semiconductors, an equipment to test semiconductors, and related support facilities required at the fabrication facility.

End Use Insights

The semiconductor manufacturing equipment market by end use is further segmented into Semiconductor Fabrication Plant/Foundry, Semiconductor Electronics Manufacturing, and Test Home. In a recent scenario, IoT is playing a major role in transforming the entire semiconductor industry driven by more internet connected devices such as smart home and autonomous vehicles. Semiconductors are required in a broad array of cloud integration and connectivity products, including sensors, computing, and communications. Therefore, to match up with the ongoing demand for semiconductors, need to have more semiconductor manufacturing equipment is required. The trend is expected to fuel the demand for semiconductor manufacturing equipment across various industries.

Strategic Insights

Market Initiative was observed as the most adopted strategy in global semiconductor manufacturing equipment industry. Few of the recent partnership, contractual alliances for the deployment of new technological solutions are listed below:

2019: SCREEN Holdings Completed New Manufacturing Facility for Semiconductor Production Equipment. The factory incorporates an earthquake-resistant, base-isolated structure and is designed to enhance SCREEN's business continuity management (BCM) and business continuity planning (BCP) systems.

2018: KLA-Tencor Corporation unveiled its plan to invest more than $70 million to establish a new research and development facility in Ann Arbor, MI. This expansion underscores the attractiveness of company's business environment as well as the strength of its logistical assets, talented workforce and high quality of life.

2017: Lam Research Corporation announced a strategic collaboration with NanoString Technologies, Inc. to develop NanoString's proprietary Hyb & Seq™ next-generation sequencing platform.

GLOBAL SEMICONDUCTOR MANUFACTURING EQUIPMENT - MARKET SEGMENTATION

By Equipment Type

Wafer Manufacturing Equipment
Assembly & Packaging Equipment
Test Equipment
Others

By Dimension

2D
2.5D
3D

By End User

Semiconductor Fabrication Plant/Foundry
Semiconductor Electronics Manufacturing
Test Home

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By Geography

North America
U.S.
Canada
Mexico
Europe
France
Germany
UK
Russia
Italy
Rest of Europe
Asia Pacific (APAC)
Taiwan
China
India
Singapore
Japan
Rest of APAC
Rest of the World (RoW)
Middle East & Africa (MEA)
South America (SAM)