Los Angeles, CA -- (SBWIRE) -- 06/18/2019 -- The Semiconductor Packaging and Assembly Equipment market was valued at Million US$ in 2017 and is projected to reach Million US$ by 2025, at a CAGR of during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Semiconductor Packaging and Assembly Equipment.
This report presents the worldwide Semiconductor Packaging and Assembly Equipment market size (value, production and consumption), splits the breakdown (data status 2013-2018 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
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The following manufacturers are covered in this report:
Applied Materials
ASM Pacific Technology (ASMPT)
Disco
EV Group (EVG)
Kulicke and Soffa Industries
Tokyo Electron Ltd. (TEL)
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Semiconductor Packaging and Assembly Equipment Breakdown Data by Type
Die-level packaging and assembly equipment
Wafer-level packaging and assembly equipment
Semiconductor Packaging and Assembly Equipment Breakdown Data by Application
Consumer Electronics
Automobile
Medical Care
Key Regions split in this report:
North America
Asia-Pacific
Europe
Central & South America
Middle East & Africa
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