Solder Ball Market 2017 by Manufacturers, Countries, Type and Application, Forecast to 2022

This Global Solder Ball Market details the actuals for 2017, and compound annual growth rate projections for 2022 for the Global markets. Selected 2017 actuals will help as a basis for today’s markets and tomorrow’s projections.


Pune, India -- (SBWIRE) -- 12/01/2017 -- Solder Ball Market reports deliver a detailed study with present and upcoming Opportunities to clarify the future investment in the market Size. Global Solder Ball Market 2017-2022 report shares information regarding key drivers, challenges and Opportunities with its impact by regions. Solder Ball Market report provides Manufacturers, regional analysis, Segment by Type & Applications and the actual process of whole Solder Ball industry.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Scope of the Report: This report focuses on the Solder Ball in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

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There are 15 Chapters to deeply display the global Solder Ball market.

Chapter 1, to describe Solder Ball Introduction, product scope, market overview, market opportunities, market risk, market driving force

Chapter 2, to analyze the top manufacturers of Solder Ball, with sales, revenue, and price of Solder Ball, in 2016 and 2017

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017

Chapter 4, to show the global market by regions, with sales, revenue and market share of Solder Ball, for each region, from 2012 to 2017

Chapter 5, 6, 7, 8 and 9, to analyze the key regions, with sales, revenue and market share by key countries in these regions

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2012 to 2017

Chapter 12, Solder Ball market forecast, by regions, type and application, with sales and revenue, from 2017 to 2022

Chapter 13, 14 and 15, to describe Solder Ball sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

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This Report Covers Market Segment by Manufacturers:

Senju Metal
DS HiMetal
Nippon Micrometal
Shanghai hiking solder material
Shenmao Technology
Market Segment by Type, covers:

Lead Solder Ball
Lead Free Solder Ball
Market Segment by Applications, can be divided into:

Flip-Chip & Others
Market Segment by Regions, regional analysis covers: North America (USA, Canada and Mexico), Europe (Germany, France, UK, Russia and Italy), Asia-Pacific (China, Japan, Korea, India and Southeast Asia), South America, Middle East and Africa

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Table of Content:

1 Market Overview

2 Manufacturers Profiles

3 Global Solder Ball Market Competitions, by Manufacturer

4 Global Solder Ball Market Analyses by Regions

5 North America Solder Ball by Countries

6 Europe Solder Ball by Countries

7 Asia-Pacific Solder Ball by Countries

8 South America Solder Ball by Countries

And more…..

List of Figures:

Figure Solder Ball Picture

Table Product Specifications of Solder Ball

Figure Global Sales Market Share of Solder Ball by Types in 2016

Table Solder Ball Types for Major Manufacturers

Figure Lead Solder Ball Picture

Figure Lead Free Solder Ball Picture

Table Solder Ball Sales Market Share by Applications in 2016

Figure BGA Picture

Figure CSP & WLCSP Picture

And more….

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