Albany, NY -- (SBWIRE) -- 10/06/2017 -- According to the research report, the worldwide market for solder balls is envisaged to post a CAGR of 6.3% for the forecast period between 2017 and 2025. By the end of the forecast period in 2025, the market could collect a revenue of US$323.7 mn, a progress from its evaluated worth of US$187.1 mn in 2016.

Benefits of Contact Reliability in Soldering Packaging Drives Demand

The growth of the solder balls market is primarily driven by the expansion of the industrial sector across several parts of the world. In the last few years, rapid growth has been observed in the automotive and electronics industry predominantly in emerging economies such as China and India. Rapid industrialization and economic development have led to an improved standard of living of people in these economies. Consequently, there is an increased demand for high quality and environmental friendly electronics and automotive products. This is directly influencing the demand for solder balls to be used in the electronics and automotive sector.

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Solder balls find extensive applications in the industrial sector. The physical properties of a solder ball, which is either placed manually or by an automated equipment, facilitates the soldering process. The use of solder balls in soldering process also increases contact reliability in packaging. Demand for technologically developed solders that deliver high level of technical performance is on the rise. This is because products that are developed using high-performance solder balls are high in quality and are high in performance. Leading manufacturers of solder balls have created teams with technical expertise that are focused on developing cost-effective solder balls with improved appearance and performance and have low impact on the ambient environment.

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Amongst the key alloy type segments, lead free solder balls accounted for the leading share in the market in 2016. Based on solder type, the segment of non-eutectic solder balls led the market in 2016. In terms of size type, 400um and above segment accounted for the leading share of the market in 2016. Solder balls of 400um and above sizes find widespread applications in automotive and electronics segments.

Asia Pacific held the leading share of the market in terms of revenue in 2016. The region is anticipated to display a leading CAGR between 2017 and 2025 amongst other key regions for solder balls.

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Environmental Concerns of Discharge of Lead to Impede Growth

On the down side, the availability of low-toxic substitutes is proving to be a roadblock to the market's growth. Restrictions imposed by several governments to address the environmental concerns associated with discharge of lead in the environment is also providing headwinds to the market's growth. This has led companies to manufacture lead free solder balls so as to abide by restrictions for the discharge of lead in these nations.

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Characterized by the presence of a handful of participants, the global solder balls market is largely consolidated yet competitive, states a new report by Transparency Market Research (TMR). Some of the prominent players in the global solder balls market are Duksan Metal Co. Ltd., Indium Corporation, Hitachi Metals Nanotech Co. Ltd., Senju Metal Industry Co. Ltd., and Nippon Micrometal Corporation.

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Transparency Market Research (TMR) is a U.S.-based provider of syndicated research, customized research, and consulting services. TMR's global and regional market intelligence coverage includes industries such as pharmaceutical, chemicals and materials, technology and media, food and beverages, and consumer goods, among others. Each TMR research report provides clients with a 360-degree view of the market with statistical forecasts, competitive landscape, detailed segmentation, key trends, and strategic recommendations.

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