New York, NY -- (SBWIRE) -- 01/20/2021 -- The global Solder Material market is forecast to reach USD 1.49 Billion by 2027, according to a new report by Reports and Data. The demand for soldering materials is expected to be powered mainly by the growth in the computer refurbishing field. Expanded development of mobile devices in various regions, coupled with the advent of a phenomenal mobile aftermarket industry, is expected to lead to the growth of such materials in the coming years. Automation is effective; soldering procedures are expected to improve demand over the projected period. Moreover, extensive R&D for the manufacture of advanced solder materials is anticipated to boost the market growth.

The report is further updated with the changes in the market dynamics and trends owing to the COVID-19 pandemic. The pandemic has affected the global economy by changing the dynamics of the supply chains, inducing financial difficulties, and the increasing volatility of market prices. The report further estimates the overall impact of the pandemic on the Solder Material market and offers key insights into the future of the market over the coming years.

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The report further studies the significant trends and demands of the market in each key region of the market and analyzes the strategic steps and initiatives taken by the leading companies of the industry. Some of the major companies operating in the Solder Material market and profiled in the report are:

Kester, Lucas Milhaupt, Inc., Qualitek International, Inc., Fusion, Inc., Senju Metal Industry Co., Ltd., Koki Company ltd., Indium Corporation, Tamura Corporation, Nihon Genma, and Stannol GmbH & Co. KG, among others.

The research study further covers the expansion and scope of the market in the key geographies across the globe. It assesses the scope of the market on a global as well as country-wise level. The market is spread across the key regions that include: North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The report provides a comprehensive analysis of the production and consumption patterns, import and export ratio, supply and demand dynamics, key trends and demands, consumer behavior, and presence and operations of prominent players in each region of the market.

The report covers the assessment of the historical data of the market to offer key insights into the current and emerging trends in the business sphere. The report considers 2017-2018 as historical years, 2019 as the base year, and 2021-2027 as forecast years. The report also discusses in detail the mergers and acquisitions, collaborations, joint ventures, product launches, brand promotions, corporate and government deals, and partnerships occurring in the market.

The report further segments the market on the basis of product types and application spectrum offered by the market.

Product Outlook (Revenue, USD Billion; 2017-2027)

Wire
Paste
Bar
Flux

Process Outlook (Revenue, USD Billion; 2017-2027)

Screen Printing
Robotic
Laser
Wave/Reflow

Application Outlook (Revenue, USD Billion; 2017-2027)

Car
Machinery & Equipment
Ship
Building
Others

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TOC -
Chapter 1. Market Synopsis

    1.1. Market Definition

    1.2. Research Scope & Premise

    1.3. Methodology

    1.4. Market Estimation Technique

Chapter 2. Executive Summary

    2.1. Summary Snapshot, 2019-2027

Chapter 3. Indicative Metrics

Chapter 4. Solder Materials Market Segmentation & Impact Analysis Continued……….

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The report is a qualitative and quantitative research study that offers key insights into the latest strategic steps and tactics undertaken by the industry players to gain a robust footing in the market. The report further offers strategic recommendations to the new and emerging players and established companies to help them overcome the barriers of the industry. The report also covers a comprehensive SWOT analysis and Porter's Five Forces analysis to offer a better understanding of the Solder Material market and its competitive landscape.

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