Future Market Insights

System-on-Package Market Trends and Competitive Landscape Outlook to 2026

FMI’s New Report, titled, “System-On-Package Market: Global Industry Analysis and Opportunity Assessment 2016-2026” offers 10-year forecast and analysis.


Valley Cottage, NY -- (SBWIRE) -- 07/05/2016 -- System-on-package is the latest technology in packaging of microelectronic components in a single chip. The integration of these microelectronic components into one chip enhances the performance as well as reduces the cost. With the increasing demand for technologically advanced mobile devices among the consumers that are capable of performing an array of functions in a single small product is boosting the system-on-package technology compared to the conventional mode of packaging for semiconductors, thus boosting the market for system-on-package market. Moreover, the system-on-package enables efficient integration of RF (Radio Frequency) front-end functional building blocks. The development of thin RF materials makes it easy to integrate into the system-on-package thus fulfilling the need of efficient wireless communication systems. With the aforementioned advantages, the global market for system-on-package is expected to register a healthy CAGR by the end of forecast period.

Global System-On-Package Market: Drivers & Restraints

The global system-on-package market is primarily driven by the rising demand among the semiconductor packaging industry for compact electronic devices with high performance and cost effective packaging. The conventional packaging cost of ICs like, die level packaging with the variation of sizes of the ICs the cost of packaging cost becomes more compared to production cost of the ICs. Whereas, the system-on-package, is cost efficient compared to the production cost of the ICs. The technological advancements in RF materials, IC design & production is also to an extent propelling the growth of global system-on-package market. Some of the new trends in the system-on-package market such as the 3D packaging, which provides improved electrical performance and packaging density, is also expected to boost the market for global system-on-packages market. The fluctuations in some of the physical properties like the coefficient of thermal expansion of the materials of used for packaging with respect to the material of ICs, which is considered as a drawback of system-on-package technology which might restraint the market for system-on-package.

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Global System-On-Package Market: Market Segmentation

Based on packaging type, the global system-on-package market can be segmented into:

BGA (Ball Grid Array) type package
QFN (Quad Flat No-leads) type package
Wafer Level Package

Based on the applications, the global system-on-package market can be segmented into:

Consumer Electronics
Others (Defense)

Global System-On-Package Market: Regional Outlook

Based on the geographic regions, global automotive seating systems marketing market is segmented into seven key market segments namely North America, Latin America, Western Europe, Eastern Europe, Asia Pacific, Japan, and Middle East & Africa. Among the aforementioned regions, the Asia-pacific market for system-on-package market is projected to grow with a promising growth rate, which is due to the increase in demand for consumer electronics in the region. Moreover, the presence of leading semiconductor manufacturers like Taiwan Semiconductor Manufacturing among others will have positive effect on the system-on-package market in APEJ. The North America and Western Europe market for system-on-package is followed by the Asia-Pacific market and is expected to show stagnant growth over the forecast period.

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Some of the major players identified in the global system-on-package market includes, ChipMOS TECHNOLOGIES INC., STATS ChipPAC Ltd., IQE PLC, Amkor Technology Inc., TriQuint Semiconductor Inc., Deca Technologies, KLA-Tencor Corporation, Siliconware Precision Industries Co. Ltd., China Wafer Level CSP Co. Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd among others.