Lewes, DE -- (SBWIRE) -- 04/12/2018 -- The report finds that shipment value of the Taiwanese IC packaging and testing industry enjoyed both year-on-year and sequential growth in the fourth quarter of 2017, to over USD 3.8 billion. The industry is forecast to have grown year-on-year in the first quarter of 2018. Overall, the industry still managed to grow over 8% in 2017 compared to 2016.

List of Topics
- This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
- Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
- The content of this report is based on primary data obtained from interviews, and publicly available information.

Spanning over 15 pages "Taiwanese IC Packaging & Testing Industry, 1Q 2018" report covers Companies - Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walto.

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