Ontario, CA -- (SBWIRE) -- 03/30/2020 -- Temporary Bonding Adhesives are materials that create a reversible adhesive bond between two surfaces. This bond can be removed (known as deboning) after a set period of time, thus making it temporary in nature. Apart from applications in the industrial sector, temporary bonding adhesives are widely used for temporary bonding of a thin wafer and carrier material in semiconductor manufacturing. Thin wafers used in semiconductor packages are extremely fragile in nature and prone to damages during manufacturing processes. Temporary Bonding Adhesives provide adhesion between thin wafers and a slightly rigid wafer carrier, thereby providing support to the thin wafer and thus, protecting it from breakage, folding or warping during rigorous manufacturing processes.

Temporary Bonding Adhesives are manufactured using a variety of chemical compositions, depending on the application they are being designed for and the types of manufacturing processes the semiconductor wafers are expected to go through. Temporary Bonding Adhesives are generally made from materials, such as low temperature waxes, oligomers and polymers of hydrocarbon origin, high temperature thermoplastics and others. Temporary bonding adhesives are expected to not only provide highly reliable adhesion between bonded surfaces, but also withstand difficult manufacturing conditions, such as electroplating, etching, etc.

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Segment by Key players:
- Daxin Materials
- Brewer Science
- Dow Electronic Materials
- AI Technology
- Elmer
- INCAE Advanced Materials
- Micro Materials
- Promerus

Segment by Type:
- 20-120
- 120-180
- 180-260
- 260-320

Segment by Application:
- Thin Wafer
- Other

Segment by Regions:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa

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Table of Content:

1. Executive Summary

2. Assumptions and Acronyms Used

3. Research Methodology

4. TEMPORARY BONDING ADHESIVES Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. TEMPORARY BONDING ADHESIVES Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. TEMPORARY BONDING ADHESIVES Market - Supply Chain
4.5. Global TEMPORARY BONDING ADHESIVES Market Forecast
4.5.1. TEMPORARY BONDING ADHESIVES Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. TEMPORARY BONDING ADHESIVES Market Size (000' Units) and Y-o-Y Growth
4.5.3. TEMPORARY BONDING ADHESIVES Market Absolute $ Opportunity

5. Global TEMPORARY BONDING ADHESIVES Market Analysis and Forecast by Type
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Type
5.2.2. Y-o-Y Growth Projections by Type
5.3. TEMPORARY BONDING ADHESIVES Market Size and Volume Forecast by Type
5.3.1. Fabricated Frame
5.3.2. Tube and Coupler
5.3.3. Mobile
5.3.4. Pole
5.4. Absolute $ Opportunity Assessment by Type
5.5. Market Attractiveness/Growth Potential Analysis by Type

6. Global TEMPORARY BONDING ADHESIVES Market Analysis and Forecast by Application
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Application
6.2.2. Y-o-Y Growth Projections by Application
6.3. TEMPORARY BONDING ADHESIVES Market Size and Volume Forecast by Application
6.3.1. Personal Decoration
6.3.2. Commercial Decoration
6.4. Absolute $ Opportunity Assessment by Application
6.5. Market Attractiveness/Growth Potential Analysis by Application

7. Global TEMPORARY BONDING ADHESIVES Market Analysis and Forecast by Sales Channel
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Sales Channel
7.2.2. Y-o-Y Growth Projections by Sales Channel
7.3. TEMPORARY BONDING ADHESIVES Market Size and Volume Forecast by Sales Channel
7.3.1. Manufacturer/Distributor/Service Provider
7.3.2. Aftermarket
7.4. Absolute $ Opportunity Assessment by Sales Channel
7.5. Market Attractiveness/Growth Potential Analysis by Sales Channel

8. Global TEMPORARY BONDING ADHESIVES Market Analysis and Forecast by Region
8.1. Market Trends
8.2. Introduction
8.2.1. Basis Point Share (BPS) Analysis by Region
8.2.2. Y-o-Y Growth Projections by Region
8.3. TEMPORARY BONDING ADHESIVES Market Size and Volume Forecast by Region
8.3.1. North America
8.3.2. Latin America
8.3.3. Europe
8.3.4. Asia Pacific
8.3.5. Middle East and Africa (MEA)
8.4. Absolute $ Opportunity Assessment by Region
8.5. Market Attractiveness/Growth Potential Analysis by Region
8.6. Global TEMPORARY BONDING ADHESIVES Demand Share Forecast, 2019-2029

Continued……

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