Market Resarch Reports.Biz include new market research report"Inorganic And Composite Printed Electronics 2014-2024: Industry Analysis, Size, Share, Growth, Trends And Forecast" to its huge collection of research reports.
Albany, NY -- (SBWIRE) -- 07/24/2014 -- This Inorganic And Composite Printed Electronics 2014-2024 report reveals the rapidly increasing opportunities for inorganic and composite chemicals in the new printed electronics, given that so much of the limelight is on organics. Inorganics encompass various metals, metal oxides as transparent conductors (such as fluorine tin oxide or indium tin oxide, extensively used in displays and photovoltaic technologies) or transistor materials as well as nano-silicon or copper and silver inks, whether in particle or flake form. Then there are inorganic quantum dots, carbon structures such as graphene, nanotubes and the various buckyballs etc. However, there is much more, from light emitting materials to battery elements and the amazing new meta-materials that render things invisible and lead to previously impossible forms of electronics.
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Over the next ten years, improvements in inorganic conductors such as the use of nanotechnology and the lack of improvement of the very poorly conductive and expensive organic alternatives means that inorganics will be preferred for most conductors whether for electrodes, antennas, touch buttons, interconnects or for other purposes. By contrast, organic substrates for flexible electronics such as low cost polyester film and paper will be preferred in most cases because they are light weight, low cost and have a wide range of mechanical flexibility. The use of inorganic substrates such as glass represents a fall-back particularly required where there is failure to reduce processing temperatures. Here stainless steel foil printed reel to reel is an improvement, where possible.
The report considers inorganic printed and thin film electronics for displays, lighting, semiconductors, sensors, conductors, photovoltaics, batteries and memory giving detailed company profiles not available elsewhere. The coverage is global - with companies from East Asia to Europe to America all included.
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The application of the technology in relation to other types such as organic electronics and silicon chips is given, with detailed information clearly summarised in many tables and figures.
Elements being targeted
In order to meet the widening variety of needs for printed and potentially printed electronics, not least in flexible, low cost form, a rapidly increasing number of elements are being brought to bear. Oxides, amorphous mixtures and alloys are particularly in evidence. Even the so-called organic devices such as OLEDs variously employ such materials as B, Al and Ti oxides and nitrides as barrier layers against water and oxygen, Al, Cu, Ag and indium tin oxide as conductors, Ca or Mg cathodes and CoFe nanodots, Ir and Eu in light emitting layers, for example.
There is increasing work on printed inorganics as people struggle with the performance of organics in some aspects. For conductors with vastly better conductance and cost, for the best printed batteries, for quantum dot devices and for transistor semiconductors with ten times the mobility, look to the new inorganics. That is the emerging world of new nanoparticle metal and alloy inks that are magnitudes superior in cost, conductivity and stability, such as the flexible zinc oxide based transistor semiconductors working at ten times the frequency and with best stability and life, along with many other inorganic materials. Read the world's only report that pulls all this together in readable form.
This report critically compares the options, the trends and the emerging applications. It is the first in the world to comprehensively cover this exciting growth area. The emphasis is on technology basics, commercialisation and the key players.
This report is suitable for all companies developing or interested in the opportunity of printed or thin film electronics materials, manufacturing technologies or complete device fabrication and integration.
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