Los Angeles, CA -- (SBWIRE) -- 04/10/2019 -- Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world's largest wafer-level packaging equipment producer.
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Wafer-level packaging equipment is very expensive, usually it does not go through the distributor and provided by the manufacturer directly to the customer.
The global Wafer-level Packaging Equipment market was 2010 million US$ in 2018 and is expected to 3710 million US$ by the end of 2025, growing at a CAGR of 9.2% between 2019 and 2025.
This report studies the Wafer-level Packaging Equipment market size (value and volume) by players, regions, product types and end industries, history data 2014-2018 and forecast data 2019-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Ultratech
Rudolph Technologies
Click to view Tables, Charts, Figures, TOC, and Companies Mentioned in the global Wafer-level Packaging Equipment market Report: https://www.qyresearch.com/index/detail/1076480/global-wafer-level-packaging-equipment-market
Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Wafer-level Packaging Equipment in these regions, from 2014 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
By the product type, the market is primarily split into
Fan In
Fan Out
By the end users/application, this report covers the following segments
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other
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