Albany, NY -- (SBWIRE) -- 12/15/2018 -- Chip-On-Flex or COF is a semiconductor assembly technology in which the die is mounted directly on the flexible substrate circuit board as against the traditional printed circuit boards, along with electrical connections. Chip-On-Flex offers multiple advantages over the printed circuit boards such as reduced weight, compact size, high reliability and lower production cost. Flexible reinforced boards, semi-flexible boards and rigid flexible boards are the different types of substrates used for Chip-On-Flex.

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The Chip-On-Flex (COF) market is primarily driven by the increased demand for adaptive and miniaturized components in wide range of applications. Another factor complimenting the growth of global Chip-On-Flex market is the increasing demand of flexible batteries. Flexible batteries is a major application of Chip-On-Flex technology which is expected to witness prominent growth in during the forecast period.

Additionally, the increasing adoption of flexible displays in applications ranging from smartphones to e-paper is anticipated to supplement the growth of Chip-On-Flex market, as it is one of the prominent application of Chip-On-Flex technology.The global Chip-On-Flex (COF) market has been segmented based on type, application, end use industry, and region. Based on type, the global Chip-On-Flex (COF) market can be classified into single sided Chip-On-Flex, double sided Chip-On-Flex, and others.

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Based on applications, the Chip-On-Flex (COF) market can be segmented into static and dynamic. Based on end use industry, the Chip-On-Flex (COF) market can be segmented into IT and telecommunication, automotive, aerospace and defense, consumer electronics, healthcare, and others.