Chip-on-Flex Market - Adds New Dimension to Innovations
Chip-On-Flex or COF is a semiconductor assembly technology in which the die is mounted directly on the flexible substrate circuit board as against the traditional printed circuit boards, along with electrical connections. Chip-On-Flex offers multiple advantages over the printed circuit boards such as reduced weight, compact size, high reliability and lower production cost. Flexible reinforced boards, semi-flexible boards and rigid flexible boards are the different types of substrates used for Chip-On-Flex.
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