Copper Wire Bonding ICs Market Scope, Forecast, Analysis by 2026
The copper wire bonding can be defined as the wire bonding process in semiconductor packaging using copper wire instead of traditional semiconductor packaging which employs aluminum or gold wires. The copper wire bonding ICs has successfully started to appear in low cost consumer grade ICs in the year of 2010, and gradually replacing the gold wire bonding ICs owing to comparative low cost optimization.
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