Embedded Die Packaging Market: Rise in Demand for Portable Electronics Industry Boost the Growth of the Market
Technologies for the embedding of active and passive components into build up layers of substrates have attracted increasing attention during recent years. Different embedding technologies have been developed due to different requirements with respect to electrical performance, chip dimensions, and interconnection. Embedding of semiconductor chips into substrates has several advantages. It allows a very high degree of miniaturization, due to the possibility of sequentially stacking of multiple layers containing an embedded components. In addition, the embedding gives a homogeneous mechanical...
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