Die Bonder Equipment Market - Company Strategy, Product Portfolio and Recent Developments for 2019
Die bonding, alternatively known as die attaching is the process of bonding or attaching a chip either to a package or to some substrate. Thus, die bonder equipment is used extensively in the fabrication process of semiconductor devices. Die bonder equipment performs various functions including picking the die from waffle tray or wafer and attaching it to the substrate. The most commonly used technique of die bonding is to push the targeted die from the tape with the help of...
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