Global System-on-Package Market Set for Rapid Growth and Trend, by 2026
System-on-package is the latest technology in packaging of microelectronic components in a single chip. The integration of these microelectronic components into one chip enhances the performance as well as reduces the cost. With the increasing demand for technologically advanced mobile devices among the consumers that are capable of performing an array of functions in a single small product is boosting the system-on-package technology compared to the conventional mode of packaging for semiconductors, thus boosting the market for system-on-package market. Moreover,...
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