Quad Flat No-Leads Packaging Market Global Industry Analysis, Size, Share and Forecast 2016-2026
Chip scale packaging is one of the packaging types for integrated circuits. Quad flat No Leads (QFN) is a one such chip scale packages with lead frame substrate. The quad flat no- leads which is plastic encapsulated package is a surface mount technology where IC's are attached to the surfaces of printed circuit boards. Quad flat no-leads electrically connect the integrated circuits to printed circuit boards (PCB). The QFN are available in configurations such as saw singulated and punch formats....
View full press release