Advanced Semiconductor Packaging Market - Miniaturization of Electronic Devices and Proper Thermal Dissipation Has Led Towards the Market Growth
During the final stages of development in a semiconductor, silicon wafer, logic board and memory are wrapped in a supporting case that prevents corrosion and physical damage of the chips that are to be connected to the circuit board. This process is known as packaging in a semiconductor industry. Packaging has evolved during the last ten years from chip-scale package, system in package and package on package to wafer-level package, 2.5D integrated circuits to 3D integrated circuits.
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