System-in-Package (SiP) Die Technologies Market Outlook 2017: Production, Sales, Supply, Demand, Analysis & Forecast to 2025
The global system-in-package (SiP) die technologies market holds out tremendous promise in the near future. SiP is a packaging technique that entails mounting a number of electronic sub components on to a single substrate along with other passive components. The unique perceived benefit of SiP is that it is not simply an IC package with multiple dies; but also contains fully functional systems or subsystems in the IC package.
View full press release