Chip Mounter Market - Advancement in the Semiconductor Technology Has Resulted in Higher Circuit Density
The technology of chip mounting has been progressing significantly in the recent past, especially with respect to a pragmatic solution to achieve high densities in case of packaging systems. It began with the traditional through hole technology (THT), followed by the more unorthodox surface mount technology (SMT) and the fine pitch technology (FPT). Most of the manufacturers have been using both these technologies for producing chips that are attached to substrates. A chip mounter package usually comprises integrated circuit chips....
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