Die Attach Materials Market to Incur Rapid Extension During 2017-2025
Die bonding is the method to attach the semiconductor die either to some substrate or to its package. Die attach materials are the materials which are used to attach components. Die attach materials comprise of two key functions including intemperance of heat produced in the die, and mechanical fixation of the die on substrate. In high-power and power applications, produced heat density is high, eutectic solder alloys or conventional die-attach adhesives are not appropriate as die-attach materials. So, for these...
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