Laser Direct Structuring Equipment Market - Rising Demand to Integrate More Electronic Circuits in Smaller Spaces Boost the Growth
Laser direct structuring equipment is used to manufacture electronic circuits in 3D molded interconnect device. 3D molded interconnect device is a thermoplastic integrated with electronic circuits. The laser beam of laser direct structuring equipment is applied for nanoseconds to manufacture 3D molded interconnect device. Laser direct structuring process consists of the following steps: injection molding, laser activation, metallization and assembly. In injection molding step, synthetic thermoplastic component is created through molding process.
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