Electronic Board Level Underfill and Encapsulation Material Market to Gain a Stronghold by 2025
Asia pacific is leading in the market of electronic board level Underfill and encapsulation material due to high demand of Underfill material in china based electronic industries. Asia pacific owns a significant market size also due to increasing demand of advanced packaging.Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service. Underfill and encapsulates are of different classes-those for Electronic board level assembly and those for IC packaging.
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