Thin Wafer Processing and Dicing Equipment Market Trends, Business Strategies and Opportunities with Key Players Analysis 2024
The recent increase in the demand for portable communication devices, such as smartphones, memory cards, smart card, and various computing devices has boosted the global market for thin wafer processing and dicing equipment substantially. In 2015, the global market for thin wafer processing and dicing equipment garnered US$388.9 mn in revenues, which, with an expected CAGR of 6.80% between 2016 and 2024, is likely to increase to US$692.5 mn by the end of 2024.
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