Chemical Polishing Slurry Market Is Supposed to Grow at a Cagr of 6.0% Between 2019 and 2025
Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are dispersed in water blended with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are smoothed and leveled with the help of abrasive slurries. This process is critical for precise lithography patterning, and is utilized after every deposition-etch step.
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