Cmp Slurry Market Is Anticipated to Grow at a Cagr of 4.0% Between 2019 and 2025
Chemical mechanical planarization (CMP) slurries are liquid dispersions containing active chemicals and microabrasive grains used for chemical mechanical planarization. CMP is a surface polishing and material removal process involving both chemical attack and abrasive removal. CMP slurries are used in conjunction with CMP pads or polishing naps, which are rotated and held against a substrate or wafer surface during the planarization process.
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