Global Chip on Flex Market Projected to Attain 2030 Million US$ by 2025 at 4.5% CAGR, Says QY Research
Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result...
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