Global Chip Scale Package LEDs Market Share and Growth 2019 - QY Research
Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a ceramic substrate, yielding a packaged LED or what is commonly referred to as an LED package. In the case of CSP LED, separate steps of having manufactured chips going through a packaging line are eliminated because at the die-level itself the chips are singulated and coated with phosphor. Solder or bond pads are installed at the wafer...
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