Epoxy Encapsulation Material Market Regional Outlook and Key Player 2018-2028: Sumitomo Bakelite, Hysol Huawei Electronics, Hexion, Shin-Etsu Chemical
Epoxy encapsulation material is an epoxy resin used as a semiconductor encapsulate. It finds applications in numerous products where semiconductors are used and employed, such as consumer home appliances, including refrigerators, television sets, vehicles and mobile phones, among others. With major economies moving towards digitalization, developments are being witnessed in the field of IT infrastructure. To match this progress, development of electronic products is picking pace, thereby creating demand for epoxy capsulation materials.
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