3D IC and 2.5D IC Packaging Market Worth $82.0 Billion by 2028
The 3D IC and 2.5D IC packaging market is expected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% during the 2023–2028 period according to a new report by MarketsandMarkets™. The major factors driving the market growth of the 3D and 2.5D IC packaging market growing demand for consumer electronics and gaming devices, increasing need for advanced architecture in electronic products, and the rising trend of increased integration density and miniaturization...
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