Bond Wire Packaging Material Market - Growing Demand for Miniaturization in the Semi-Conductor Industry Drives the Growth
The diameter of bonding wires ranges from 15 micrometers to several hundred micrometers for high-powered applications. An important market trend that is expected to boost the global Bonding Wire Packaging Material market is the migration to smaller diameter wires. This migration is primarily fueled by the increasing demand for miniaturization. Manufacturers are using bonding wires as an intermediate product opts for small diameter bonding wires because it is an effective way to reduce costs, as materials used in bonding wires...
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