Three-Dimensional Integrated Circuit Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecasts 2016–2024
Three-dimensional integrated circuit(3D IC) comes under the branch of microelectronics; it is an integrated circuit which is produced by the stacking silicon wafers and dies and they are vertically interconnected using through-silicon vias. They now act as single device giving better performance at minimum power usage and smaller footprint than the traditional 2D processes. The 3D IC packaging has benefits if not of the same level but does not compromise on the form factor.
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