The Demand for Embedded Die Packaging Technology Is Expected to Increase Globally During the Forecast Period
According to a new report published by Allied Market Research, titled, "Embedded Die Packaging Technology Market by Platform and Industry Vertical: Global Opportunity Analysis and Industry Forecast, 2017-2023," the global embedded die packaging technology market was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. The embedded die in IC package substrate segment contributed nearly 47% share to the global market in 2016.
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