Underfill Dispenser Market Valuation Will Reach US $91.19 Bn by the End of 2025 from US $42.73 Bn in 2016
Underfill material is a filler, which is used in semiconductor packaging to offer strength, increase the impact resistance, and improve the overall reliability and thermo-mechanical performance. It is used to fill space beneath a die and adhere to its carrier. The proliferation of smart technologies and the subsequently rising demand for handheld devices such as smartphones and tablets are the key factors fuelling the demand for underfill dispensers. The demand is forecast to remain comparatively higher across emerging nations, which...
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