System in Package (SiP) Technology Market – Smart Strategies of the Research and Development Process
System in packaging (SiP) technology is a mixture of various integrated circuits in a compact size to enable reduction of power consumption. Moreover, they offer numerous benefits, such as high efficiency, low system complexity, and reduced system maintenance. 2.5-D IC Packaging represents almost 40% of the total SiP market, owing to its resilience and high efficiency. In addition, substantial demand for electronics applications and trend of customer shift towards advanced IC packaging to achieve better efficiency are expected to fuel...
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