Chemical Mechanical Planarization Market 2016 - 2024
The semiconductor wafer fabrication process includes a critical technological procedure called as chemical mechanical planarization (CMP). The top surface of the wafer is planarized or polished in this procedure to produce a flat surface that is flawless and is essential to make powerful and faster semiconductor devices. Constant improvements in chemical mechanical planarization has significantly helped in enhancing the output of semiconductor devices and that too at a fairly lesser unit cost. CMP is commonly used in ultra-flat surface processing...
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