ESD Foam Packaging Market - Electrical and Electronic Component Outpaces Other Applications with Aggressive Growth
The global electrostatic discharge (ESD) foam packaging market is expected to impress with a substantial rise in demand due to the swift surge in the miniaturization of electronic devices. Moreover, there is a rise in the demand for mobility in devices around the globe, which could augur well for the market. The adoption of smaller, lightweight devices could be greatly augmented with the demand for mobility.
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