Global ESD Foam Packaging Market Poised to Gain Significant Growth During Forecast 2017-2022
The electrostatic discharge foam packaging market is estimated to have ample growth opportunities in future, riding on the shoulders of booming smartphone demand coupled with the emerging trend of electronic miniaturization. Rising demand for ESD foam packaging market might be impacted by robust ICT infrastructure needed for IoT. Electrostatic discharge foam packaging is typically deployed to avoid damaging sensitive electronics parts because of the current generated via packaging material interaction.
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