System in Package Market Worth 9.07 Billion USD by 2023
According to the new market research report "System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023", the system in package market is expected to grow from USD 5.79 Billion in 2017 to USD 9.07 Billion by 2023, at a CAGR of 9.4%.
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