Advanced Semiconductor Packaging Market to Witness Significant Growth in the Coming Years
Semiconductor packaging provides protection to substrate and wafer. The materials used in packaging semiconductor are metal, plastic, ceramic or glass. However, manufacturers have started using some of the advanced semiconductor packaging technologies such as flip-chip, Fan-Out Wafer-Level Packaging (FO-WLP), Fan-In Wafer-Level Packaging (FI-WLP) and 2.5D and 3D packaging. Although 2.5D technology emerged as a bridge technology between 2D and 3D ICs, it has evolved as largely used package solution alongside 3D ICs. The demand for 3D packaging is increasing due...
View full press release