Multi-Chip Module Packaging Market - Increasing Demand for Further Miniaturizationof Aerospace and Defense Systems
Multi-chip module packaging has received wide range of attention in the electronics industry. Multi-chip module packaging has been applied in the advanced and high end systems. The technology primarily focuses on leveraging surface mount and integrated circuits (IC) processing technology. The Multi-chip module was primarily designed for multiple ICs (integrated circuits) to increase their application as a single package. The market has been segmented into by end use industry automotive, aerospace and defense, consumer electronics, telecommunications and healthcare among others....
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