Semiconductor Packaging Market Is Expected to Grow at a Healthy Rate of 12.31% During 2018-2023
In the semiconductor industry, packaging has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product, owing to the growing demand across various end-user verticals of the industry. The identification of 2.5D and 3D packaging mechanism, as of mid-2010, has made semiconductor manufacturers to extend their flip-chip and wafer-level capabilities, owing to their enhanced functionality. The advent of IoT, artificial intelligence (AI), and proliferation of sophisticated electronics are the factors driving the high-end application segment...
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