Market Research on System in Package (SiP) Market Worth $18.10 Billion by 2020
According to a new market research report "System in Package (SiP) Market by Technology (2D, 2.5D & 3D), Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) - Global Trends & Forecasts to - 2014 - 2020", the total System in Package (SiP) market is expected to reach $18.10 Billion by 2020, growing at a CAGR of 9.57% from 2013 to 2020.
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