Molded Interconnect Devices (MID) Market Focuses on Top Manufacturers - Molex, RTP Company, TE Connectivity, BASF, DSM, Evonik, LANXESS
The Molded Interconnect Devices (MID) Market is projected to witness a strong growth across consumer device applications owing to the ability of the devices to integrate numerous electrical and mechanical functions, reduce circuit density, and facilitate miniaturization of the products. The devices require fewer auxiliary components, thereby saving considerable costs and driving the industry growth. Low failure ratio and high reliability of these devices can be attributed to the existence of less auxiliary components and a low degree of system...
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